CEMEDINE SX-ECA48 One-Part Low-Temperature-Curing Flexible Conductive Adhesive
CEMEDINE SX-ECA48 is a one-part flexible conductive adhesive in the SX-ECA Series. It uses a moisture-curing polymer system that can develop both adhesion and electrical conductivity at relatively low temperatures, helping reduce thermal damage to heat-sensitive electronic components. After curing, SX-ECA48 retains excellent flexibility, allowing it to follow substrate deformation and withstand vibration and thermal shock. CEMEDINE also reports good adhesion to a broad range of materials including gold, copper, tin, nickel, ITO and glass. The product is supplied as a silver-colored paste with a viscosity of approximately 350 Pa·s at 23°C, density of approximately 3.1 g/cm³, volume resistivity of approximately 1.5×10⁻³ Ω·cm, and thermal conductivity of approximately 2.6 W/m·K. Its glass transition temperature is approximately -62°C, providing excellent low-temperature flexibility.
Product Details
Product Features
Low-Temperature Curing:Moisture curing allows the adhesive to develop performance at near-room temperature, while moderate heating can accelerate curing.
Excellent Flexibility:Tg of approximately -62°C helps maintain flexibility under vibration, thermal cycling and substrate movement.
Low Electrical Resistance:Volume resistivity of approximately 1.5×10⁻³ Ω·cm.
Excellent Adhesion Durability:Combines conductive performance with durable elastic bonding.
Conductivity Durability:Designed to maintain electrical performance under vibration and thermal shock.
High EMI Shielding Performance:Shielding effectiveness is greater than 40 dB, corresponding to more than 99% shielding over the tested frequency range.
Product Applications
Low-Temperature Electronic Assembly:Mounting and bonding electronic components near heat-sensitive materials.
ACF Alternative:Suitable for selected applications where anisotropic conductivity is not required.
Electrical Grounding:Conductive grounding of electrical and electronic components.
EMI Shielding:Conductive sealing and noise suppression in electronic devices.
Flexible & Wearable Electronics:Conductive bonding and circuit formation on fabrics, films and flexible substrates.
PCB Repair & Electronic Modules:Suitable for circuit-board repair, camera modules and display-related sealing applications.
| Item | CEMEDINE SX-ECA48 |
|---|---|
| Product Type | One-Part Flexible Conductive Adhesive |
| Brand | CEMEDINE |
| Model | SX-ECA48 |
| Grade | Low-Temperature-Curing / Flexible / Conductive |
| Base | Acrylic-Modified Special Polymer |
| Appearance | Silver Paste |
| Viscosity | 350 Pa·s at 23°C |
| Density | 3.1 g/cm³ |
| Tack-Free Time | Approx. 5 min |
| Tensile Shear Strength | 1.0 MPa |
| Glass Transition Temperature | -62°C |
| Elastic Modulus | 225 MPa |
| Coefficient of Linear Expansion | 190 ppm/K |
| Thermal Conductivity | 2.6 W/m·K |
| Volume Resistivity | 1.5×10⁻³ Ω·cm |
| Shielding Effectiveness | >40 dB |
| Shielding Ratio | >99% |
| Cure Mechanism | Moisture Cure |
| Compliance | RoHS Compliant |
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