CEMEDINE EP170 One-Part Heat-Curing Flexible High-Peel Epoxy Adhesive
CEMEDINE EP170 is a one-part heat-curing epoxy resin adhesive classified as a flexible, high-peel-strength grade. Compared with conventional rigid epoxy systems, EP170 provides greater flexibility after curing, helping absorb stresses caused by vibration, impact and differences in thermal expansion between bonded materials. Because EP170 is a one-component system, no resin/hardener measuring or mixing is required. This helps reduce variation caused by incorrect mixing ratios or insufficient mixing. CEMEDINE also describes this series as a reactive solvent-free adhesive with low curing shrinkage, high adhesion, good durability and excellent electrical insulation. EP170 is a light-yellow material with a viscosity of approximately 170 Pa·s at 20°C and a density of approximately 1.13 g/cm³. Standard curing conditions are 110°C × 60 minutes or 120°C × 30 minutes. After curing, tensile shear strength is approximately 15.1 MPa, while T-peel strength reaches approximately 6.67 N/mm, highlighting its strong peel resistance.
Product Details
Product Features
High Peel Strength:T-peel strength of approximately 6.67 N/mm, suitable for joints exposed to peel forces, impact or vibration.
Flexible Cured Material:Helps reduce stress concentration between bonded materials.
One-Part System:No mixing or ratio control is required, improving production consistency.
Heat-Curing:Standard curing at 110°C × 60 min or 120°C × 30 min.
Low Curing Shrinkage:Suitable for precision assembly where dimensional stability is important.
Excellent Electrical Insulation:Volume resistivity of approximately 3.0×10¹⁵ Ω·cm.
Product Applications
Electrical & Electronic Components:Bonding and sealing of electronic and electrical assemblies.
Precision Equipment:Fixing and assembling precision mechanical components.
Composite Materials:Bonding of architectural and industrial composite materials.
Vibration-Resistant Assemblies:Suitable for components exposed to vibration and impact.
Dissimilar Material Bonding:Flexible adhesive layer helps accommodate differences in thermal expansion.
Industrial Assembly:Suitable for applications requiring high peel resistance and controlled heat curing.
| Item | CEMEDINE EP170 |
|---|---|
| Product Type | One-Part Heat-Curing Epoxy Adhesive |
| Brand | CEMEDINE |
| Model | EP170 |
| Series | Flexible Type |
| Grade | High-Peel Type |
| Base | Epoxy Resin |
| Appearance | Light Yellow |
| Viscosity | 170 Pa·s at 20°C |
| Density | 1.13 g/cm³ |
| Standard Curing Condition | 110°C × 60 min |
| Alternative Curing Condition | 120°C × 30 min |
| Tensile Shear Strength | 15.1 MPa |
| T-Peel Strength | 6.67 N/mm |
| Hardness | Shore D 55 |
| Glass Transition Temperature | 20°C |
| Water Absorption | 0.23% |
| Linear Expansion Coefficient | 30×10⁻⁵ /K |
| Volume Resistivity | 3.0×10¹⁵ Ω·cm |
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