CEMEDINE EP106NL One-Part Heat-Curing Low-Viscosity Epoxy Adhesive
CEMEDINE EP106NL is a one-part heat-curing epoxy resin adhesive in CEMEDINE’s general-purpose lineup, specifically classified as a low-viscosity flow type. Because no resin/hardener measuring or mixing is required, it helps reduce bonding variation caused by mixing errors. EP106NL is a reactive solvent-free epoxy adhesive offering low curing shrinkage, high adhesion, good durability and excellent electrical insulation. Its relatively low viscosity makes it suitable for applications where the adhesive needs to flow into narrow gaps or spread evenly over the bonding area.
Product Details
Product Features
One-Part System:No measuring or mixing process is required.
Low-Viscosity Flow Type:Approx. 22 Pa·s at 23°C for good flow and gap penetration.
Heat-Curing:Standard cure at 120°C × 40 min, with 150°C × 20 min also listed.
High Bond Strength:Tensile shear strength of approximately 24.1 MPa.
Good Peel Resistance:T-peel strength of approximately 3.48 N/mm.
Excellent Electrical Insulation:Volume resistivity of approximately 2.6×10¹⁵ Ω·cm.
Product Applications
Electrical & Electronic Components:Bonding and sealing of electrical and electronic parts.
Precision Equipment:Fixing and assembling precision components.
Composite Building Materials:Bonding of architectural composite materials.
Craft & Industrial Assembly:Assembly of parts requiring reliable adhesive strength.
Gap-Filling Flow Applications:Suitable where low-viscosity adhesive flow into narrow spaces is required.
| Item | CEMEDINE EP106NL |
|---|---|
| Product Type | One-Part Heat-Curing Epoxy Adhesive |
| Brand | CEMEDINE |
| Model | EP106NL |
| Grade | Low-Viscosity Flow Type |
| Base | Epoxy Resin |
| Appearance | Milky White |
| Viscosity | 22 Pa·s at 23°C |
| Density | 1.18 g/cm³ |
| Standard Curing Condition | 120°C × 40 min |
| Alternative Curing Condition | 150°C × 20 min |
| Tensile Shear Strength | 24.1 MPa |
| T-Peel Strength | 3.48 N/mm |
| Hardness | Shore D 84 |
| Glass Transition Temperature | 91°C |
| Water Absorption | 0.14% |
| Linear Expansion Coefficient | 7.8×10⁻⁵ /K |
| Volume Resistivity | 2.6×10¹⁵ Ω·cm |
| Storage Temperature | 0°C–10°C |
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