CEMEDINE EP160 One-Part Heat-Curing Heat-Resistant Epoxy Adhesive
CEMEDINE EP160 is a one-part heat-curing epoxy resin adhesive designed for industrial applications. CEMEDINE classifies EP160 as a heat-resistant, medium-viscosity grade in its one-component epoxy adhesive range. No resin/hardener measuring or mixing is required, helping reduce variation caused by mixing errors. EP160 cures by heating and is designed for applications requiring elevated-temperature performance. Official data lists curing conditions of 110°C × 60 min or 120°C × 30 min, while another official CEMEDINE heat-resistance page also lists 150°C × 15 min. Its glass transition temperature is approximately 140°C. After curing, EP160 provides structural bonding strength, low curing shrinkage, durability and electrical insulation. CEMEDINE lists applications including bonding and sealing of electrical/electronic components, bonding of architectural composite materials, and assembly of precision equipment and craft products.
Product Details
Product Features
High Heat Resistance:Glass transition temperature of approximately 140°C.
One-Part System:No measuring or mixing of separate components is required.
Heat Curing:Typical curing conditions include 110°C × 60 min and 120°C × 30 min; 150°C × 15 min is also listed by CEMEDINE.
High Structural Bond Strength:Tensile shear strength of approximately 16.8 MPa.
Low Curing Shrinkage:Curing shrinkage rate of approximately 2.43%.
Excellent Electrical Insulation:Volume resistivity of approximately 2.6 × 10¹⁵ Ω·cm.
Product Applications
Electrical & Electronic Components:Bonding and sealing of electrical and electronic assemblies.
Heat-Resistant Industrial Components:For parts requiring reliable bonding under elevated-temperature conditions.
Precision Equipment:Assembly and fixation of precision mechanical components.
Composite Building Materials:Bonding of selected architectural composite materials.
Industrial Assembly:Suitable for applications requiring strength, durability and dimensional stability.
| Item | CEMEDINE EP160 |
|---|---|
| Product Type | One-Part Heat-Curing Epoxy Adhesive |
| Brand | CEMEDINE |
| Model | EP160 |
| Grade | Heat-Resistant / Medium-Viscosity Type |
| Base | Epoxy Resin |
| Appearance | Light Brown to Light Yellow Paste |
| Viscosity | Approx. 100 Pa·s at 23°C |
| SDS Reference Dynamic Viscosity | 70,000–130,000 mPa·s |
| Density | Approx. 1.16 g/cm³ |
| SDS Relative Density | 1.1–1.2 |
| Standard Cure | 110°C × 60 min / 120°C × 30 min |
| Alternative Official Cure | 150°C × 15 min |
| Tensile Shear Strength | 16.8 MPa |
| T-Peel Strength | 1.18 N/mm |
| Hardness | Shore D 85 |
| Glass Transition Temperature | 140°C |
| Elastic Modulus | 414 MPa |
| Breaking Strength | 22.6 MPa |
| Curing Shrinkage | 2.43% |
| Water Absorption | 0.05% |
| Linear Expansion Coefficient | 6.5 × 10⁻⁵ /K |
| Volume Resistivity | 2.6 × 10¹⁵ Ω·cm |
| Dielectric Constant | 4.5 at 100Hz |
| Dielectric Loss Tangent | 0.011 at 1kHz |
| Packaging | 1 kg |
| Storage | Refrigerated |
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