CEMEDINE EP331 Two-Part Room-Temperature-Curing Low-Viscosity Epoxy Adhesive
CEMEDINE EP331 is a two-part room-temperature-curing epoxy resin adhesive classified by CEMEDINE as a 30-minute, low-viscosity grade. The base resin is epoxy and the hardener is polyamide, with a standard 1:1 mixing ratio by weight. EP331 has a very low viscosity compared with conventional epoxy adhesives: approximately 4 Pa·s for the base resin and 7 Pa·s for the hardener at 23°C. This provides excellent flow and wetting behavior, making it suitable for narrow gaps, complex components and applications where the adhesive needs to spread easily across the bonding surface. The pot life is approximately 30 minutes, while practical handling strength is reached in approximately 1 hour. After curing, tensile shear strength is approximately 17.6 MPa, with Shore D hardness of approximately 71 and high electrical resistivity.
Product Details
Product Features
Low-Viscosity Flow Type:Approx. 4 Pa·s for the base and 7 Pa·s for the hardener at 23°C.
30-Minute Working Time:Provides enough time for positioning and adjustment of complex assemblies.
Room-Temperature Cure:No heating equipment is required for standard curing.
High Bond Strength:Tensile shear strength of approximately 17.6 MPa.
Low Curing Shrinkage:Epoxy chemistry provides relatively low dimensional change during curing.
Good Electrical Insulation:Volume resistivity of approximately 2.4×10¹⁵ Ω·cm.
Product Applications
Metal Bonding:For steel, stainless steel, aluminum, copper and other metal components.
Industrial Components:Bonding of machinery, precision parts and general industrial assemblies.
Electrical & Electronic Components:Suitable for bonding and fixing components requiring electrical insulation.
Narrow-Gap Bonding:Low viscosity allows the adhesive to flow into small gaps.
Dissimilar Material Bonding:Suitable for a broad range of metals, plastics and other industrial substrates.
Precision Assembly:Useful where longer positioning time and uniform adhesive flow are required.
| Item | CEMEDINE EP331 |
|---|---|
| Product Type | Two-Part Room-Temperature-Curing Epoxy Adhesive |
| Brand | CEMEDINE |
| Model | EP331 |
| Grade | 30-Minute / Low-Viscosity Type |
| Base Resin | Epoxy Resin |
| Hardener | Polyamide |
| Base Appearance | Light Yellow Transparent |
| Hardener Appearance | Light Yellow Transparent |
| Base Viscosity | 4 Pa·s at 23°C |
| Hardener Viscosity | 7 Pa·s at 23°C |
| Base Density | 1.16 g/cm³ |
| Hardener Density | 1.16 g/cm³ |
| Mixing Ratio | Base:Hardener = 1:1 by weight |
| Pot Life | Within 30 min |
| Time to Practical Strength | Approx. 1 hour |
| Standard Curing Condition | 23°C × 24 hours |
| Tensile Shear Strength | 17.6 MPa |
| T-Peel Strength | Not listed in the official table |
| Hardness | Shore D 71 |
| Coefficient of Linear Expansion | 7.1×10⁻⁵ |
| Glass Transition Temperature | 41°C |
| Volume Resistivity | 2.4×10¹⁵ Ω·cm |
| Water Absorption | 0.8% |
CEMEDINE EP170 One-Part Heat-Curing Flexible High-Peel Epoxy Adhesive
CEMEDINE EP160 One-Part Heat-Curing Heat-Resistant Epoxy Adhesive
CEMEDINE EP106NL One-Part Heat-Curing Low-Viscosity Epoxy Adhesive
CEMEDINE HM622-10 High-Tack Hot Melt Pressure-Sensitive Adhesive
CEMEDINE EM139-2 Modified Water-Based Vinyl Acetate Emulsion Adhesive for Paper Tubes
CEMEDINE EM128LL Low-Viscosity Water-Based Emulsion Adhesive for Corrugated Board
CEMEDINE Y630D Metal Lock High-Strength High-Heat-Resistance Second-Generation Acrylic Structural Adhesive
