CEMEDINE HM200 Fast-Setting EVA Hot Melt Adhesive for Corrugated Board and Paper Packaging
CEMEDINE HM200 is an EVA-based hot melt adhesive designed primarily for corrugated board and paper-processing applications. CEMEDINE classifies HM200 as a quick-hardening grade, applied in a molten state and rapidly bonded through cooling. HM200 is a 100% solids, solvent-free adhesive. At room temperature, it is supplied as light-yellow pellets/pieces. Its melt viscosity is approximately 910 mPa·s at 180°C, with a softening point of approximately 108°C. At 23°C, the open time is approximately 2–4 seconds, while the hardening time is approximately 1–2 seconds. CEMEDINE states that its HM hot melt adhesives provide rapid bonding, compatibility with a broad range of materials, and easy automation, making them suitable for corrugated boxes, carton production and packaging assembly.
Product Details
Product Features
Fast Setting:Hardening time of approximately 1–2 seconds at 23°C.
Short Open Time:Approx. 2–4 seconds at 23°C for rapid joining.
100% Solids:Contains no water or organic solvent.
EVA-Based System:Designed for paper and packaging bonding applications.
Suitable for Automation:Ideal for continuous hot melt dispensing and automated packaging lines.
Heat and Low-Temperature Resistance:Approx. 60°C heat resistance and -10°C low-temperature resistance.
Product Applications
Corrugated Board:Bonding and sealing of corrugated board structures.
Carton Manufacturing:Fast bonding of carton sides, bottoms and packaging structures.
Paper Products:Bonding of paperboard and paper packaging materials.
Packaging Assembly:Assembly of boxes and packaging components.
Automated Production Lines:Suitable for high-speed hot melt application equipment.
| Item | CEMEDINE HM200 |
|---|---|
| Product Type | Hot Melt Adhesive |
| Brand | CEMEDINE |
| Model | HM200 |
| Main Application | Corrugated Board / Paper Packaging |
| Grade | Quick-Hardening Type |
| Base | EVA |
| Appearance | Light Yellow Pellets / Pieces |
| Non-Volatile Content | 100 wt% |
| Softening Point | 108°C |
| Melt Viscosity | 910 mPa·s at 180°C |
| Open Time | 2–4 sec at 23°C |
| Hardening Time | 1–2 sec at 23°C |
| Heat Resistance | 60°C |
| Low-Temperature Resistance | -10°C |
| Curing Mechanism | Cooling / Solidification |
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