Galden® HT55 PFPE
Suwei GALDEN HT55 is a special coolant with excellent characteristics.Suitable for high-performance thermal management and dielectric cooling applications in semiconductor equipment, electronic testing equipment, and precision industrial temperature control systems.
Product Details
Product Details
Suitable boiling point and efficient variable heat transfer
Excellent thermal stability and chemical inertness
Excellent dielectric properties
Wide working temperature range
High level of safety and environmental friendliness
Direct immersion cooling: Heat generating electronic components (such as computer chips and servers) are directly immersed in GALDEN HT55 liquid, utilizing liquid boiling and circulation to remove a large amount of heat and achieve efficient heat dissipation.
Semiconductor and Electronics Industry: Used for special processes such as etching and ion implantation in chip manufacturing, as well as reliability testing of electronic components
In other industrial fields, such as pharmaceuticals (such as freeze dryers), chemicals, aviation, etc., it is also used as a thermal fluid that requires stable and safe heat transfer.
| Performance | HT55 |
|---|---|
| Boiling point | 55 ℃ |
| Pour point | <-125 ℃ |
| Density | 1.65 g/cm³ |
| Kinematic viscosity | 0.45 cSt |
| Steam pressure | 225 torr |
| Specific heat | 0.23 cal/g·℃ |
|
Latent heat of vaporization (near boiling point) |
22 cal/g |
| Refractive index | 1.28 |
| Coefficient of thermal expansion | 0.0011 cm³/cm³℃ |
| Surface tension | 14 dyne/cm |
| Thermal conductivity | 0.065 W/m·K |
| Dielectric strength(2.54 mm gap) | 40 kV |
| Dielectric constant | 1.86 |
| Volume resistivity | 1×10¹² Ohm·cm |
| Average molecular weight | 340 amu |
| Dissipation factor(1 KHz) | 2×10⁻⁴ |
| Water solubility | <10 ppm (wt) |
| Air solubility | 26 cm³ gas/100 cm³ liquid |