TERADA TERADITE TE-7817 High-Thermal-Conductivity High-Heat-Resistance Flame-Retardant Epoxy Potting Resin
TERADITE TE-7817 is a two-component high-thermal-conductivity epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE High Thermal Conductivity Resin series, which is primarily designed for potting of electric and electronic parts. TE-7817 provides a thermal conductivity of approximately 6.5 W/m·K, making it one of the higher thermal-conductivity grades in this product series. Its mixed viscosity is approximately 58,400 mPa·s at 25°C and 20,400 mPa·s at 60°C, with a specific gravity of approximately 3.24. After curing, the resin provides a Shore D hardness of approximately 91, a Tg of approximately 156°C, and a very low CTE of approximately 8 ppm/K. Its volume resistivity is greater than 1×10¹⁵ Ω·cm, allowing the material to combine high thermal conductivity with electrical insulation. The recommended resin-to-hardener mixing ratio is 100:100.
Product Details
Product Features
High Thermal Conductivity: Approximately 6.5 W/m·K for efficient heat dissipation
High Heat Resistance: Tg of approximately 156°C
Very Low Thermal Expansion: CTE of approximately 8 ppm/K
Electrical Insulation: Volume resistivity greater than 1×10¹⁵ Ω·cm
Flame Retardant: Listed as a UL94 flame-retardant grade in the catalog
High Hardness: Shore D hardness of approximately 91 after curing
Product Applications
Power Electronics: Thermal potting of power modules and heat-generating electronic components
Electronic Components: Insulation, encapsulation and thermal management of electronic parts
Electrical Assemblies: Potting and protection of power supplies and electrical modules
Automotive Electronics: Thermal encapsulation of automotive electrical and electronic components
Sensors & Coils: Insulation and potting protection of sensors, coils and related components
Industrial Electronics: Thermal management and encapsulation of controllers, inverters and industrial electronic modules
| Item | TERADITE TE-7817 |
|---|---|
| Product Type | Two-Component Thermally Conductive Epoxy Resin |
| Main Application | Potting of Electric and Electronic Parts |
| Mixed Viscosity at 25°C | 58,400 mPa·s |
| Mixed Viscosity at 60°C | 20,400 mPa·s |
| Specific Gravity at 25°C | 3.24 |
| Hardness | Shore D 91 |
| Glass Transition Temperature | 156°C |
| CTE (α1) | 8 ppm/K |
| Flexural Strength at 25°C | 50 MPa |
| Flexural Modulus at 25°C | 24,000 MPa |
| Volume Resistivity at 25°C | >1×10¹⁵ Ω·cm |
| Thermal Conductivity at 25°C | 6.5 W/m·K |
| Flame Retardancy | UL94 Flame-Retardant Grade |
| Mix Ratio (Resin / Hardener) | 100 / 100 |
| Recommended Curing Condition | 100°C × 1 h + 160°C × 1 h |