TERADA TERADITE TE-6011K Fast-Curing Two-Component Epoxy Resin for Electronic Insulation & Protection
TERADITE TE-6011K is a two-component functional epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE Functional Resin series and is primarily designed for the insulation and protection of electronic components. Its key characteristic is fast curing. The recommended curing condition is 25°C for 4 hours, allowing room-temperature curing without high-temperature oven processing. At 25°C, the resin viscosity is approximately 21,500 mPa·s, the hardener viscosity is approximately 10,500 mPa·s, and the mixed viscosity is approximately 19,500 mPa·s. After curing, TE-6011K provides a Shore D hardness of approximately 87, a glass transition temperature of approximately 40°C, and a CTE of approximately 30 ppm/K. Its shear bond strength on SUS/SUS is approximately 23 MPa. The recommended resin-to-hardener mix ratio is 100:38.
Product Details
Product Features
Fast Curing: Recommended curing at 25°C for 4 hours
Room-Temperature Cure: No high-temperature oven curing required
High Bond Strength: Approx. 23 MPa shear bond strength on SUS/SUS
High Hardness: Shore D hardness of approximately 87 after curing
Two-Component System: Resin-to-hardener mixing ratio of 100:38
Electrical Protection: Designed for insulation and protection of electronic components
Product Applications
Electronic Components: Insulation, potting and protection of electronic parts
Electrical Assemblies: Protection of electrical modules and functional assemblies
Sensor Components: Potting and fixing of sensors and related parts
Automotive Electronics: Protection of automotive electrical modules and components
Fast Production Processes: Suitable for applications where shorter curing time is required
Industrial Electronics: Protection of controllers, modules and industrial electronic devices
| Item | TERADITE TE-6011K |
|---|---|
| Product Type | Two-Component Functional Epoxy Resin |
| Series | Functional Resin |
| Main Application | Insulation and Protection of Electronic Components |
| Key Characteristic | Fast Curing |
| Resin Viscosity at 25°C | 21,500 mPa·s |
| Hardener Viscosity at 25°C | 10,500 mPa·s |
| Mixed Viscosity at 25°C | 19,500 mPa·s |
| Specific Gravity at 25°C | 1.65 |
| Hardness | Shore D 87 |
| Glass Transition Temperature | 40°C |
| CTE (α1) | 30 ppm/K |
| Shear Bond Strength | 23 MPa |
| Test Substrate | SUS / SUS |
| Flame Retardancy | Not Listed in Catalog |
| Mix Ratio (Resin / Hardener) | 100 / 38 |
| Recommended Curing Condition | 25°C × 4 h |
