TERADA TERADITE TE-6311K8 Low-Specific-Gravity Two-Component Epoxy Resin for Electronic Insulation & Protection
TERADITE TE-6311K8 is a two-component functional epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE Functional Resin series and is primarily intended for the insulation and protection of electronic components. Its key feature is its low specific gravity. At 25°C, the specific gravity is approximately 0.78, making it particularly suitable for electronic applications where weight reduction is important. The resin viscosity is approximately 95,000 mPa·s, the hardener viscosity approximately 30 mPa·s, and the mixed viscosity approximately 2,170 mPa·s. After curing, TE-6311K8 provides a Shore D hardness of approximately 76, a Tg of approximately 34°C, and a CTE of approximately 52 ppm/K. Its shear bond strength on SUS/SUS is approximately 22 MPa. The recommended resin-to-hardener mixing ratio is 100:36, with a recommended curing condition of 25°C for 24 hours.
Product Details
Product Features
Low Specific Gravity: Approximately 0.78 at 25°C for lightweight applications
Room-Temperature Curing: Recommended curing condition of 25°C × 24 h
High Bond Strength: Approximately 22 MPa shear bond strength on SUS/SUS
Two-Component System: Resin-to-hardener mixing ratio of 100:36
Good Flow After Mixing: Mixed viscosity of approximately 2,170 mPa·s
Electrical Protection: Designed for insulation and protection of electronic components
Product Applications
Electronic Components: Insulation, encapsulation and protection of electronic parts
Electrical Assemblies: Protection of electrical modules and functional assemblies
Lightweight Electronics: Suitable for components where weight reduction is important
Sensor Components: Potting and protection of sensors and related parts
Automotive Electronics: Suitable for automotive electrical modules and components
Industrial Electronics: Protection of controllers, modules and industrial electronic devices
| Item | TERADITE TE-6311K8 |
|---|---|
| Product Type | Two-Component Functional Epoxy Resin |
| Series | Functional Resin |
| Main Application | Insulation and Protection of Electronic Components |
| Key Characteristic | Low Specific Gravity |
| Resin Viscosity at 25°C | 95,000 mPa·s |
| Hardener Viscosity at 25°C | 30 mPa·s |
| Mixed Viscosity at 25°C | 2,170 mPa·s |
| Specific Gravity at 25°C | 0.78 |
| Hardness | Shore D 76 |
| Glass Transition Temperature | 34°C |
| CTE (α1) | 52 ppm/K |
| Shear Bond Strength | 22 MPa |
| Test Substrate | SUS / SUS |
| Flame Retardancy | Not Listed in Catalog |
| Mix Ratio (Resin / Hardener) | 100 / 36 |
| Recommended Curing Condition | 25°C × 24 h |
