TERADA TERADITE TE-6430 Thermally Conductive Flame-Retardant Two-Component Epoxy Potting Resin
TERADITE TE-6430 is a two-component thermally conductive epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE High Thermal Conductivity Resin series and is designed primarily for potting of electric and electronic parts. TE-6430 provides a thermal conductivity of approximately 2.4 W/m·K. Its mixed viscosity at 25°C is approximately 16,000 mPa·s, with a specific gravity of approximately 2.80, making it suitable for electronic assemblies requiring both heat transfer and electrical protection. After curing, the resin has a Shore D hardness of approximately 81, a Tg of approximately 80°C, and a CTE of approximately 19 ppm/K. Its volume resistivity is greater than 1×10¹³ Ω·cm. The recommended resin-to-hardener mixing ratio is 100:4, with a recommended curing condition of 25°C for 24 hours.
Product Details
Product Features
High Thermal Conductivity: Approximately 2.4 W/m·K for improved heat transfer
Room-Temperature Cure: Recommended curing at 25°C for 24 hours
Flame Retardant: Equivalent to UL94 V-0 at 5 mm thickness
Electrical Insulation: Volume resistivity greater than 1×10¹³ Ω·cm
Low Thermal Expansion: CTE of approximately 19 ppm/K
Two-Component System: Resin-to-hardener mixing ratio of 100:4
Product Applications
Electronic Components: Thermal potting, insulation and protection of electronic parts
Electrical Assemblies: Encapsulation of electrical modules and related components
Power Electronics: Suitable for components requiring heat transfer and electrical insulation
Sensor Components: Potting and protection of sensors, coils and related parts
Automotive Electronics: Thermal encapsulation of automotive electronic components
Industrial Electronics: Potting and thermal management of controllers and industrial electronic modules
| Item | TERADITE TE-6430 |
|---|---|
| Product Type | Two-Component Thermally Conductive Epoxy Resin |
| Main Application | Potting of Electric and Electronic Parts |
| Mixed Viscosity at 25°C | 16,000 mPa·s |
| Specific Gravity at 25°C | 2.80 |
| Hardness | Shore D 81 |
| Glass Transition Temperature | 80°C |
| CTE (α1) | 19 ppm/K |
| Flexural Strength at 25°C | 15 MPa |
| Flexural Modulus at 25°C | 1,500 MPa |
| Volume Resistivity at 25°C | >1×10¹³ Ω·cm |
| Thermal Conductivity at 25°C | 2.4 W/m·K |
| Flame Retardancy | UL94 V-0 Equivalent at 5 mm |
| Mix Ratio (Resin / Hardener) | 100 / 4 |
| Recommended Curing Condition | 25°C × 24 h |
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