TERADA TERADITE TE-6010GK5 Low-Chlorine High-Heat-Resistance Two-Component Epoxy Resin
TERADITE TE-6010GK5 is a two-component functional epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE Functional Resin series and is primarily intended for the insulation and protection of electronic components. Its key characteristic is its low-chlorine formulation, with the catalog specifying a chlorine content of 10 ppm or less. At 25°C, the resin viscosity is approximately 130,000 mPa·s, the hardener viscosity approximately 4,000 mPa·s, and the mixed viscosity approximately 4,400 mPa·s. After curing, TE-6010GK5 provides a Shore D hardness of approximately 87, a glass transition temperature of approximately 180°C, and a CTE of approximately 44 ppm/K. Its shear bond strength on SUS/SUS is approximately 17 MPa. The recommended resin-to-hardener mix ratio is 100:70, with recommended curing conditions of 80°C for 2 hours or 120°C for 20 minutes.
Product Details
Product Features
Low Chlorine: Chlorine content of 10 ppm or less
High Heat Resistance: Tg of approximately 180°C
High Hardness: Shore D hardness of approximately 87 after curing
Two-Component System: Resin-to-hardener mixing ratio of 100:70
Flexible Curing Process: Can be cured at 80°C × 2 h or 120°C × 20 min
Electrical Protection: Designed for insulation and protection of electronic components
Product Applications
Electronic Components: Insulation, potting and protection of electronic parts
Semiconductor-Related Components: Suitable for applications sensitive to chlorine and ionic contamination
Sensor Components: Protection of sensors, coils and related electronic parts
Automotive Electronics: Protection of automotive electrical modules and electronic components
High-Temperature Electronics: Suitable for components requiring high Tg and heat resistance
Industrial Electronics: Protection of controllers, modules and industrial electronic devices
| Item | TERADITE TE-6010GK5 |
|---|---|
| Product Type | Two-Component Functional Epoxy Resin |
| Series | Functional Resin |
| Main Application | Insulation and Protection of Electronic Components |
| Key Characteristic | Low Chlorine |
| Chlorine Content | ≤10 ppm |
| Resin Viscosity at 25°C | 130,000 mPa·s |
| Hardener Viscosity at 25°C | 4,000 mPa·s |
| Mixed Viscosity at 25°C | 4,400 mPa·s |
| Specific Gravity at 25°C | 1.45 |
| Hardness | Shore D 87 |
| Glass Transition Temperature | 180°C |
| CTE (α1) | 44 ppm/K |
| Shear Bond Strength | 17 MPa |
| Test Substrate | SUS / SUS |
| Flame Retardancy | Not Listed in Catalog |
| Mix Ratio (Resin / Hardener) | 100 / 70 |
| Recommended Curing Conditions | 80°C × 2 h or 120°C × 20 min |
