Shin-Etsu KE-4898-T Low-Molecular-Siloxane-Reduced Translucent Silicone Adhesive Sealant
KE-4898-T is a one-component room-temperature-curing silicone rubber in Shin-Etsu’s KE-489 series. It cures by a moisture-condensation alcohol-type reaction, forming a tough, flexible silicone elastomer after exposure to atmospheric moisture. Shin-Etsu classifies KE-4898 as a paste-type, low-molecular-siloxane-reduced sealing material. The product provides low odor, non-corrosive curing and good unprimed adhesion to many substrates including metals, plastics, glass and ceramics. Shin-Etsu test data show adhesion to aluminum, copper, glass, ABS, polycarbonate, PBT and epoxy substrates. The suffix “T” denotes translucent. KE-4898-T also has a low-molecular-weight siloxane content ΣD3–D10 of below 300 ppm, making it suitable for electrical, electronic and precision applications where volatile siloxane contamination is a concern.
Product Details
Product Features
One-Component RTV Cure:No mixing is required; the product cures at room temperature in the presence of atmospheric moisture.
Neutral Alcohol-Type Cure:Low-odor condensation cure with low corrosivity toward metals.
Low Molecular Siloxane Content:ΣD3–D10 is below 300 ppm, helping reduce volatile siloxane contamination in sensitive electronic assemblies.
Good Adhesion:Provides good adhesion to a broad range of metals, glass, ceramics and engineering plastics without primer.
Flexible Elastomer:Typical Shore A hardness is about 40 with elongation at break of approximately 360%, providing vibration and stress absorption.
Good Electrical Insulation:Typical volume resistivity is approximately 30 TΩ·m and dielectric breakdown strength approximately 25 kV/mm.
Product Applications
Electronic Component Sealing:For sealing and moisture protection of PCBs, electronic modules, sensors and electrical components.
Component Fixing:For flexible fixing of electronic parts, wiring and connectors.
Metal and Plastic Bonding:Suitable for substrates including aluminum, stainless steel, copper, ABS, polycarbonate, PBT and epoxy materials.
Form-in-Place Gasketing:Can be applied directly to mating surfaces to form an elastic gasket after curing.
General Industrial Sealing:Suitable for industrial assemblies requiring flexibility, temperature resistance and electrical insulation.
| Item | KE-4898-T |
|---|---|
| Product Type | One-Component Silicone Adhesive Sealant |
| Brand | Shin-Etsu |
| Model | KE-4898-T |
| Cure Type | Condensation Cure |
| By-Product Type | Alcohol |
| Physical Form | Paste |
| Color | Translucent |
| Density at 23°C | Approx. 1.04 g/cm³ |
| Tack-Free Time | Approx. 6 min |
| Shore A Hardness | Approx. 40 |
| Tensile Strength | Approx. 2.2 MPa |
| Elongation at Break | Approx. 360% |
| Lap Shear Strength, Al/Al | Approx. 0.8 MPa |
| Volume Resistivity | Approx. 30 TΩ·m |
| Dielectric Breakdown Strength | Approx. 25 kV/mm at 1 mm thickness |
| Relative Permittivity | Approx. 2.8 at 50 Hz |
| Dielectric Dissipation Factor | Approx. 1×10⁻³ at 50 Hz |
| Low-Molecular Siloxanes ΣD3–D10 | ＜300 ppm |
| Service Temperature Range | -40°C to 180°C |
| Reference Cure Condition | Approx. 7 days at 23°C / 50% RH for full properties |
Shin-Etsu KE-109E A/B Two-Component Transparent Low-Temperature-Cure Silicone Potting Rubber
Shin-Etsu KE-109(A/B) Two-Component Transparent Addition-Cure Silicone Rubber
Shin-Etsu KS-63W Silicone Oil Compound for Electrical Insulation and Sealing
Shin-Etsu KF-965 Heat-Resistant Dimethyl Silicone Release Agent
Shin-Etsu KF-351A Polyether-Modified Silicone Fluid
