Shin-Etsu G-776 High-Reliability Thermal Interface Grease
G-776 is a high-reliability thermal interface grease developed by Shin-Etsu Silicone for semiconductor elements and heat sinks. It fills microscopic gaps between mating surfaces to reduce thermal contact resistance and improve heat transfer from electronic components to heat sinks. The product offers high resistance to pump-out, creep and oil separation, helping maintain stable thermal performance during long-term thermal cycling and elevated-temperature operation. Shin-Etsu’s comparative testing shows substantially reduced oil bleeding compared with conventional products. G-776 is a solvent-diluted thermal grease, providing easier application than highly viscous thermal compounds. After solvent evaporation, its typical thermal conductivity is approximately 1.3 W/m·K. The content of low-molecular-weight siloxanes ΣD3–D10 is controlled to below 100 ppm, supporting high-reliability electronic applications.
Product Details
Product Features
Good Thermal Conductivity:Typical thermal conductivity is approximately 1.3 W/m·K after solvent evaporation.
High Pump-Out Resistance:Helps prevent grease migration from the thermal interface during repeated heating and cooling cycles.
Low Oil Bleed:Provides significantly reduced oil separation compared with conventional thermal greases.
Easy Application:Solvent-diluted formulation offers relatively low viscosity and good coating workability.
Excellent Electrical Properties:Typical dielectric strength is approximately 11.6 kV/mm.
Wide Service Temperature Range:Suitable for approximately -40°C to 200°C.
Product Applications
Semiconductor Devices:For thermal interfaces between semiconductor components and heat sinks.
Heat Sink Interfaces:Fills microscopic surface gaps to improve heat dissipation.
High-Reliability Electronics:Suitable for assemblies requiring resistance to pump-out, creep and oil bleed during long-term thermal cycling.
Power Electronics:For power modules, electronic power devices and assemblies requiring both heat transfer and electrical insulation.
Precision Electronic Assemblies:Suitable for applications requiring controlled low-molecular-weight siloxane content and long-term reliability.
| Item | G-776 |
|---|---|
| Product Type | Thermal Interface Grease |
| Brand | Shin-Etsu |
| Model | G-776 |
| Component Type | One-Component |
| Formulation | Solvent-Diluted Thermal Grease |
| Appearance | White Grease |
| Density | Approx. 2.9 g/cm³ at 23°C |
| Viscosity | Approx. 58–60 Pa·s |
| Penetration | Approx. 354 ×0.1 mm |
| Thermal Conductivity | Approx. 1.3 W/m·K after solvent evaporation |
| Thermal Resistance | Approx. 7.4 mm²·K/W at 7.8 μm BLT |
| Dielectric Strength | Approx. 11.6 kV/mm |
| Volatile Content | Approx. 3.10% |
| Low Molecular Weight Siloxanes ΣD3–D10 | ＜100 ppm |
| Service Temperature Range | -40°C to 200°C |
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