Shin-Etsu KE-109E A/B Two-Component Transparent Low-Temperature-Cure Silicone Potting Rubber
KE-109E A/B is a two-component addition-cure liquid silicone rubber developed by Shin-Etsu Silicone for electrical and electronic potting applications. Both components are transparent, low-viscosity liquids and are mixed at a 100:100 weight ratio before heat curing. The addition-cure system does not generate condensation-type by-product gas. A key feature of KE-109E A/B is its combination of low-temperature curing and high transparency. Shin-Etsu’s current electrical/electronic liquid silicone rubber guide identifies it as a low-temperature-cure grade for LED lighting, while the company’s LED selection guide recommends it for highly transparent potting of LED modules. After curing, KE-109E A/B forms a flexible transparent silicone rubber with a typical Shore A hardness of approximately 25, tensile strength of approximately 1.3 MPa, and elongation at break of approximately 140%. It also provides good electrical insulation and adhesion to substrates such as printed circuit boards, metals, plastics, glass and ceramics.
Product Details
Product Features
Low-Temperature Heat Cure:Designed for relatively low-temperature curing, making it suitable for LED and electronic assemblies where excessive heat exposure is undesirable.
High Transparency:Both components are transparent, and the cured rubber remains optically clear for LED and display applications.
Adhesive Properties:Shin-Etsu identifies KE-109E A/B as a transparent adhesive grade, with adhesion to PCB substrates, metals, plastics, glass and ceramics.
Good Electrical Insulation:Typical volume resistivity is approximately 6.0 TΩ·m, with dielectric breakdown strength of approximately 23 kV/mm.
Flexible Protection:A Shore A hardness of approximately 25 and elongation of approximately 140% provide flexible mechanical protection for electronic components.
Self-Leveling and Low Viscosity:Good flow and self-leveling characteristics help the material fill complex gaps during potting.
Product Applications
LED Encapsulation:For transparent encapsulation of LED diodes and LED lighting modules.
LED Display and Lighting Modules:Suitable for high-transparency full potting of LED assemblies.
LCD Display Ruggedizing:Suitable for encapsulation and reinforcement of LCD display modules.
PCB and Electronic Module Protection:For insulating, fixing and protecting printed circuit boards and electronic assemblies.
Transparent Electronic Potting:For applications requiring transparency, flexibility and electrical insulation in one material.
| Item | KE-109E A/B |
|---|---|
| Product Type | Two-Component Transparent Liquid Silicone Potting Rubber |
| Brand | Shin-Etsu |
| Model | KE-109E A/B |
| Cure Mechanism | Addition Cure |
| Cure Method | Heat Cure |
| Main Features | Low-Temperature Cure / Transparent / Adhesive |
| Appearance, Part A | Transparent |
| Appearance, Part B | Transparent |
| Viscosity, Part A | Approx. 1 Pa·s at 23°C |
| Viscosity, Part B | Approx. 1 Pa·s at 23°C |
| Mixed Viscosity | Approx. 1.0 Pa·s |
| Mix Ratio | A:B = 100:100 by weight |
| Pot Life | Approx. 240 min at 23°C |
| Standard Cure | 100°C × 1 h |
| Cured Density | Approx. 1.00 g/cm³ at 23°C |
| Shore A Hardness | Approx. 25 |
| Tensile Strength | Approx. 1.3 MPa |
| Elongation at Break | Approx. 140% |
| Volume Resistivity | Approx. 6.0 TΩ·m |
| Dielectric Breakdown Strength | Approx. 23 kV/mm |
| Relative Permittivity | Approx. 2.8 at 50 Hz |
| Dielectric Dissipation Factor | Approx. 6×10⁻⁴ at 50 Hz |
| Thermal Conductivity | Approx. 0.15 W/m·K |
| Tensile Lap-Shear Strength, Al/Al | Approx. 0.2 MPa |
| Low-Molecular-Weight Siloxanes ΣD3–D10 | ＜300 ppm |
| UL94 Flammability | HB |
| UL RTI | 150°C, Electrical / Impact / Strength |
| Reference Service Temperature | -40°C to 180°C |
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