TERADA TERADITE TE-7901 Thermally Conductive Flame-Retardant Two-Component Epoxy Potting Resin
TERADITE TE-7901 is a two-component thermally conductive epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE High Thermal Conductivity Resin series and is mainly designed for potting of electric and electronic parts. The TERADITE resin series is developed for electric/electronic devices and automotive parts, offering functional resins with excellent thermal conductivity, high heat resistance and other advanced properties. TE-7901 provides a thermal conductivity of approximately 4.0 W/m·K. Its mixed viscosity is approximately 86,000 mPa·s at 25℃ and 15,000 mPa·s at 60℃. After curing, it achieves Shore D hardness of approximately 90, Tg of approximately 100℃, and flexural strength of approximately 115 MPa, making it suitable for electronic encapsulation requiring mechanical reliability.
Product Details
Product Features
High Thermal Conductivity:Thermal conductivity of approximately 4.0 W/m·K for efficient heat dissipation
High Mechanical Strength:Flexural strength of approximately 115 MPa for reliable encapsulation
Excellent Electrical Insulation:Volume resistivity above 1×10¹⁵ Ω·cm
Flame Retardant Performance:Complies with UL94 flame-retardant requirements
High Hardness Protection Layer:Shore D hardness of approximately 90 after curing
Two-Component Epoxy System:Suitable for industrial potting processes
Product Applications
Electronic Components:Potting, fixation and thermal protection of electronic parts
Electrical Equipment:Insulation and protection of power modules and electrical assemblies
Power Electronics:Thermal management and encapsulation of heat-generating components
Automotive Electronics:Protection and thermal encapsulation of automotive electronic modules
Sensors and Coils:Sealing and protection of sensor and coil components
Industrial Electronics:Encapsulation of controllers, drivers and electronic modules
| Item | TERADITE TE-7901 |
|---|---|
| Product Type | Two-Component Thermally Conductive Epoxy Resin |
| Main Application | Potting of Electric and Electronic Parts |
| Curing Type | Heat Curing |
| Mixed Viscosity (25℃) | 86,000 mPa·s |
| Mixed Viscosity (60℃) | 15,000 mPa·s |
| Specific Gravity (25℃) | 3.10 |
| Hardness | Shore D 90 |
| Glass Transition Temperature (Tg) | 100℃ |
| CTE (α1) | 15 ppm/K |
| Flexural Strength (25℃) | 115 MPa |
| Flexural Modulus (25℃) | 28,000 MPa |
| Volume Resistivity (25℃) | ＞1×10¹⁵ Ω·cm |
| Thermal Conductivity (25℃) | 4.0 W/m·K |
| Flame Retardancy | UL94 ○ |
| Recommended Curing Condition | 100℃×1h＋160℃×1h |
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