EP008A two-component reactive epoxy resin adhesive
CEMEDINE EP008A is a two-component, room-temperature curing flexible epoxy adhesive based on epoxy resin and modified polyamide. Its high-viscosity, non-sag formulation provides both strong adhesion and flexibility after curing, making it suitable for industrial applications exposed to peel stress, vibration, and thermal aging.
Product Details
Product Features
Two-component flexible epoxy system combining high bonding strength with toughness
High T-peel strength for applications exposed to peel stress
High-viscosity non-sag formulation suitable for vertical surfaces
Good heat resistance and thermal aging resistance for long-term industrial use
Applicable Industries / Equipment
Electronics & Electrical: Electronic components, electrical assemblies, power components and sealing areas
Machinery Manufacturing: Mechanical parts, assemblies and precision equipment
Construction Materials: Composite panels, structural composites and building components
Precision Manufacturing: Precision instruments, industrial equipment and assembly parts
| Project | Parameters |
| Product Name | EP008A Two-component reactive epoxy resin adhesive |
| Usage/Characteristics/Advantages | Plastic type, anti-sagging type |
| Type | Bi-component mixed reactive epoxy type adhesive |
| Main Components |
Resin: Epoxy resin; Hardener: Modified polyamide |
| Appearance |
Resin: White; Hardener: Light brown |
| Non-volatile Content |
Resin: 99.8 wt%; Hardener: 96.0 wt% |
| Viscosity（Pa·s/23℃） |
Resin: 275; Hardener: 100 |
| Densit（g/cm³） |
Resin: 1.19; Hardener: 0.98 |
| Standard curing conditions | 23℃×7 days or 80℃×1 hour |
| Mixing Ratio | 1 : 1 |
| Usable Time (23℃) | 60 minutes |
| Time to Reach Practical Strength (23℃) | 12 hours |
| Tensile Shear Bond Strength | 23.0 MPa |
| T-type Peel Bond Strength | 2.5 N/mm |
| Hardness (Shore D) | 80 |
| Glass Transition Temperature | 57℃ |
| Elastic Modulus | 1800 MPa |
| Water Absorption Rate | 1.8% |
| Linear Expansion Rate | 9.4×10⁻⁵ /K |
| Volume Resistivity | 2.6×10¹⁵ Ω·cm |
| Surface Resistance | 2.5×10¹⁵ Ω/sq |
| Dielectric Constant (1kHz) | 3.29 |
| Dielectric Loss Tangent (1kHz) | 0.02 |
| Capacitance Specification |
Resin 500g per jar + Hardener 500g per jar; Resin 15kg per jar + Hardener 15kg per jar |
TERADA TERADITE TE-7901 Thermally Conductive Flame-Retardant Two-Component Epoxy Potting Resin
TERADA TERADITE TRU-0252K5 Hard-Type UV-LED Curable Functional Resin
TERADA TERADITE TE-7817 High-Thermal-Conductivity High-Heat-Resistance Flame-Retardant Epoxy Potting Resin
TERADA TERADITE TRU-0250K High-Thixotropy High-Heat-Resistance UV Curable Functional Resin
TERADA TERADITE TE-6430 Thermally Conductive Flame-Retardant Two-Component Epoxy Potting Resin
TERADA TERADITE TRU-0251FR High-Tg Flame-Retardant UV Curable Functional Resin
TERADA TERADITE TE-6010GK5 Low-Chlorine High-Heat-Resistance Two-Component Epoxy Resin
TERADA TERADITE TE-6011K Fast-Curing Two-Component Epoxy Resin for Electronic Insulation & Protection
Shin-Etsu Pure Sealant One-Component Low-Volatility Silicone Sealant for Clean Rooms
TERADA TERADITE TE-6311K8 Low-Specific-Gravity Two-Component Epoxy Resin for Electronic Insulation & Protection
TERADA TERADITE TRU-0260K2 High-Specific-Gravity High-Hardness UV-LED Curable Functional Resin
