EP007A two-component reactive epoxy resin adhesive
CEMEDINE EP007A is a two-component, room-temperature curing flexible epoxy adhesive consisting of an epoxy resin base and a modified polyamide hardener. It combines high bonding strength with flexibility and provides good peel strength, heat resistance and thermal aging resistance for industrial bonding applications.
Product Details
Product Features
Flexible epoxy system combining high bonding strength and toughness
High peel strength for applications exposed to vibration and peeling stress
Good heat resistance and thermal aging resistance
Lower viscosity for better flow and coating performance compared with non-sag EP008A
Applicable Industries / Equipment
Electronics & Electrical: Electronic components, electrical assemblies, power components and sealing areas
Precision Manufacturing: Precision instruments, precision equipment and industrial components
Construction Materials: Composite panels, structural composites and assembly components
Industrial Manufacturing: Mechanical assemblies, craft products and general industrial components
| Product Name | EP007A Two-component Reactive Epoxy Resin Adhesive |
| Usage/Characteristics/Advantages | Plasticity type |
| Type | Two-component mixed reactive epoxy type adhesive |
| Main Components | Base Material: Epoxy Resin; Hardener: Modified Polyamide |
| Appearance |
Base material: Light yellow transparent; Curing agent: Light brown |
| Non-volatile matter |
Base material: 99.7 wt%; Curing agent: 96.0 wt% |
| Viscosity (Pa·s/23℃) |
Base material: 6; Curing agent: 34 |
| Density (g/cm³) |
Base material: 1.17; Curing agent: 0.95 |
| Standard curing conditions | 23℃ for 7 days or 80℃ for 1 hour |
| Mix ratio | 1 : 1 |
| Usable time (23℃) | 60 minutes |
| Time to reach practical strength (23℃) | 12 hours |
| Tensile shear bonding strength | 21.8 MPa |
| T-shaped peel bonding strength | 1.5 N/mm |
| Hardness (Shore D) | 78 |
| Glass transition temperature | 61℃ |
| Elastic modulus | 1500 MPa |
| Water absorption rate | 0.8% |
| Linear expansion rate | 9.5×10⁻⁵ /K |
| Volume resistivity | 1.9×10¹⁵ Ω·cm |
| Surface resistance | 8.1×10¹⁴ Ω/sq |
| Dielectric constant (1kHz) | 3.63 |
| Capacitance specification | Base material 500g per jar + Curing agent 500g per jar; |
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