CEMEDINE EP138

CEMEDINE EP138 is a one-component heat-curing epoxy adhesive designed for demanding industrial applications such as automotive electronics, power modules, LED packaging, heat-resistant electronic components and precision assembly.

The product provides good heat resistance, chemical resistance and high bonding strength. It offers good adhesion to metals, ceramics and certain plastics. After heat curing, EP138 forms a strong and stable adhesive layer suitable for applications requiring thermal resistance, vibration resistance and long-term reliability.

As a one-component system, EP138 does not require on-site mixing, making it suitable for automated dispensing and mass-production processes. The curing conditions shown in the provided material are 120°C for 30 minutes or 150°C for 20 minutes.

Product Features

Chemical resistance: Suitable for industrial environments involving acids, alkalis and other chemical media.

High heat resistance: Maintains stable bonding performance under elevated temperatures.

High bonding strength: Good adhesion to metals, ceramics and certain plastics.

Industrial reliability: Suitable for automotive electronics, electrical equipment and precision assemblies.

One-component heat curing: No A/B mixing required, supporting efficient automated production.

Precision application: Suitable for bonding, fixing and encapsulation of small and high-precision components.

Applicable Industries / Equipment

Industries: Automotive electronics, electronics and electrical equipment, power modules, LED, precision instruments, industrial automation and chemical equipment.

Typical Applications:

Bonding and fixing of electronic transformers and motor cores

Heat-resistant electronic components and power modules

Metal / ceramic / plastic composite bonding

Chemical equipment and storage-tank related sealing and fixing

Speaker voice coils, sensors and precision components

Automated production requiring accelerated heat curing