BOND SL220 (B/W) Fast-Curing Adhesive
KONISHI BOND SL220(B/W) is a one-component moisture-curing elastic adhesive based on silane-modified polymer technology. It requires no mixing and cures at room temperature through atmospheric moisture. After curing, it forms a flexible and durable adhesive layer that absorbs vibration, impact and thermal expansion stress, making it suitable for reliable bonding of industrial equipment, automotive and electronic components.
Product Details
Product Features
One-component moisture curing with no mixing required
Balanced curing speed for both productivity and application adjustment
Flexible cured layer absorbing vibration, impact and thermal stress
Good weather resistance, water resistance and long-term durability
Applicable Industries / Equipment
Automotive: Body components, interior parts and electronic components
Industrial Equipment: Automation equipment, mechanical assemblies and metal structures
Electronics & Electrical: Electronic modules, electrical components and control equipment
Construction & Assembly: Metal panels, composite materials and structural fixing parts
| Parameter Item | Parameter Value |
| Product Type | Modified Epoxy Resin (Black Paste + White Paste Two-component) |
| Color Marking | Black Paste (Component A) + White Paste (Component B) |
| Viscosity (25°C) | 8,000 - 12,000 mPa·s (Paste Form) |
| Bonding Strength | Black Paste: 250,000 ± 50,000 mPa·s; White Paste: 200,000 ± 40,000 mPa·s |
| Temperature Resistance | -40°C ~ +150°C (Long-term) |
| Model | SL210(B/W)、SL210 C、SL220(B/W)、SL220 LB、SL420 H(B/W) |
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