BOND SL210(B/W) Super Fast-Curing Adhesive
KONISHI BOND SL210(B/W) is a one-component moisture-curing elastic adhesive based on silane-terminated polymer technology. It provides ultra-fast curing performance without mixing and cures at room temperature by reacting with moisture in the air. After curing, it forms an elastic adhesive layer suitable for applications exposed to vibration, impact and differences in thermal expansion between materials.
Product Details
Product Features
Ultra-fast curing with skin formation in approximately 2–5 minutes
One-component solvent-free formulation requiring no mixing
Free from organic tin compounds for improved environmental performance
Elastic and impact-resistant adhesive suitable for vibration parts and dissimilar materials
Applicable Industries / Equipment
Electronics & Electrical: Circuit boards, electronic components, electrical equipment and sensors
Automotive: Automotive electronic parts, interior components and vibration parts
Industrial Equipment: Automation equipment, mechanical assemblies, metal and plastic structures
Display & Precision Equipment: Display components and precision assemblies
| Parameter Item | Parameter Value |
| Product Type | One-component epoxy resin adhesive |
| Color Marking | White |
| Viscosity (25°C) | 8,000 - 12,000 mPa·s (paste-like) |
| Curing Conditions | 80°C × 30 minutes or 25°C × 24 hours |
| Bonding Strength | ≥ 18 MPa (steel-to-steel) |
| Temperature Resistance | -40°C ~ +150°C (long-term) |
| Model | SL210(B/W)、SL210 C、SL220(B/W)、SL220 LB、SL420 H(B/W) |
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