BOND SL 210C Super Fast-Curing Adhesive
KONISHI BOND SL210C is a clear, one-component moisture-curing elastic adhesive based on silane-modified polymer technology. It requires no mixing and cures rapidly at room temperature through atmospheric moisture. After curing, it forms a transparent and flexible adhesive layer that absorbs vibration, impact and thermal expansion stress between different materials.
Product Details
Product Features
Clear formulation suitable for applications requiring high appearance quality
Ultra-fast curing with short skin formation time for improved productivity
One-component moisture curing with no mixing required
Flexible cured layer with good vibration resistance and weather resistance
Applicable Industries / Equipment
Electronics & Electrical: Display components, electronic modules and sensor parts
Automotive: Lamp assemblies, interior parts and electronic components
Industrial Equipment: Automation equipment, mechanical assemblies and transparent parts
Precision Manufacturing: Optical components, glass assemblies and precision parts
| Parameter Item | Parameter Value |
| Chemical Type | Cyanoacrylate Ethyl Ester (ECA) |
| Color Marking | Transparent liquid → Non-colored and transparent after curing |
| Viscosity (25°C) | 100-500 mPa·s |
| Curing Time | Initial cure: 5 - 30 seconds (25°C/50%RH); Complete cure: 24 hours |
| Shear Strength | ≥15 MPa（ABS-ABS，ASTM D1002） |
| Temperature | -40°C ~ +80°C (long-term) |
| Model | SL210(B/W)、SL210 C、SL220(B/W)、SL220 LB、SL420 H(B/W) |
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