BOND FB500 W Silicone Modified Polymer Adhesive
KONISHI BOND FB500（B/W） is a one-component moisture-curing elastic adhesive based on silicone-modified polymer technology, specially developed for electrical and electronic applications. It provides UL94 V-0 flame retardancy and forms a flexible elastic adhesive layer after curing, helping absorb vibration, impact and thermal stress.
Product Details
Product Features
UL94 V-0 flame-retardant grade suitable for high-safety electronic equipment
One-component moisture curing with no mixing required
Controlled low molecular weight siloxane content for precision electronic applications
Flexible cured layer with good vibration resistance and thermal stress resistance
Applicable Industries / Equipment
Electronics & Electrical: PCB assemblies, electronic components, power modules and wire harness fixing
Automotive Electronics: ECUs, sensors and vehicle electronic components
Industrial Equipment: Control cabinets, automation equipment and electrical modules
Communication Equipment: Communication modules, electronic devices and precision electrical components
| Purpose | Specialty |
| Resin bonding and filling of electrical and electronic components | 1. Liquid room-temperature curing elastic adhesive |
| Bonding rigid plastics such as polycarbonate and ABS to metal | UL94 V-0 flame retardant certification |
| Scenarios requiring initial bond strength | Flame retardants free of tin, halogens, phosphorus, and antimony |
| Bonding of rigid materials with different coefficients of thermal expansion | Compliant with RoHS standards (for six harmful substances) |
| Bonding of parts susceptible to impact and vibration | Free of low molecular weight cyclic polysiloxanes |
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