KONISHI

BOND FB500 ZW Silicone-Modified Polymer Adhesive

KONISHI BOND FB500 ZW is a white, one-component moisture-curing elastic adhesive based on silicone-modified polymer technology, specially developed for electrical and electronic applications. It provides UL94 V-0 flame retardancy and forms a flexible elastic layer after curing, helping absorb vibration, impact and thermal stress.

CategoryAn adhesive
BrandKONISHI
ColorWhite
Specification120ml/tube,333ml/tube
ApplicationCan be used for bonding of electrical and electronic components

Product Details

Product Features

UL94 V-0 flame-retardant grade for high safety electronic applications
One-component moisture curing with no mixing required
Controlled low molecular weight siloxane content for precision electronic applications
Flexible cured layer with good vibration and thermal stress resistance

 

Applicable Industries / Equipment

Electronics & Electrical: PCB assemblies, electronic components, power modules and wire harness fixing
Automotive Electronics: ECUs, sensors and vehicle electronic components
Industrial Equipment: Control cabinets, automation equipment and electrical modules
Communication Equipment: Communication modules, precision electronic devices and display components

Applications     Features
Bonding & potting resin for electrical and electronic parts     One-part, room-temperature curing elastic adhesive
Bonding of rigid plastics (PC, ABS) to metals     UL94 V-0 flame retardant certified
Where high initial bond strength is required     Free of tin, halogen, phosphorus & antimony flame retardants
Bonding of rigid materials with different thermal expansion coefficients RoHS compliant (6 restricted substances)
Bonding of parts exposed to shock and vibration     Free of low-molecular cyclic siloxanes