BOND FB500 ZW Silicone-Modified Polymer Adhesive
KONISHI BOND FB500 ZW is a white, one-component moisture-curing elastic adhesive based on silicone-modified polymer technology, specially developed for electrical and electronic applications. It provides UL94 V-0 flame retardancy and forms a flexible elastic layer after curing, helping absorb vibration, impact and thermal stress.
Product Details
Product Features
UL94 V-0 flame-retardant grade for high safety electronic applications
One-component moisture curing with no mixing required
Controlled low molecular weight siloxane content for precision electronic applications
Flexible cured layer with good vibration and thermal stress resistance
Applicable Industries / Equipment
Electronics & Electrical: PCB assemblies, electronic components, power modules and wire harness fixing
Automotive Electronics: ECUs, sensors and vehicle electronic components
Industrial Equipment: Control cabinets, automation equipment and electrical modules
Communication Equipment: Communication modules, precision electronic devices and display components
| Applications | Features |
| Bonding & potting resin for electrical and electronic parts | One-part, room-temperature curing elastic adhesive |
| Bonding of rigid plastics (PC, ABS) to metals | UL94 V-0 flame retardant certified |
| Where high initial bond strength is required | Free of tin, halogen, phosphorus & antimony flame retardants |
| Bonding of rigid materials with different thermal expansion coefficients | RoHS compliant (6 restricted substances) |
| Bonding of parts exposed to shock and vibration | Free of low-molecular cyclic siloxanes |