BOND FB500 ZB Silicone-Modified Polymer Adhesive
KONISHI BOND FB500 ZB is a black, one-component moisture-curing elastic adhesive based on silicone-modified polymer technology. It is designed for fixing, sealing and protection of electrical and electronic equipment. The product provides UL94 V-0 flame retardancy and controlled low molecular weight siloxane content. After curing, it forms a flexible elastic layer that absorbs vibration, impact and thermal stress, providing long-term reliability for precision electronic components.
Product Details
Product Features
UL94 V-0 flame-retardant grade suitable for high-safety electronic equipment
Controlled low molecular weight siloxane content for precision electronic and electrical applications
One-component moisture curing with no mixing required
Flexible cured layer with good vibration resistance and thermal stress resistance
Applicable Industries / Equipment
Electronics & Electrical: PCB assemblies, electronic components, power modules and sensors
Automotive Electronics: ECUs, vehicle control modules and electronic components
Semiconductor Equipment: Precision electronic devices, control units and sensor modules
Industrial Equipment: Control cabinets, automation equipment and electrical components
| Applications | Features |
| Bonding & potting resin for electrical and electronic parts | One-part, room-temperature curing elastic adhesive |
| Bonding of rigid plastics (PC, ABS) to metals | UL94 V-0 flame retardant certified |
| Where high initial bond strength is required | Free of tin, halogen, phosphorus & antimony flame retardants |
| Bonding of rigid materials with different thermal expansion coefficients | RoHS compliant (6 restricted substances) |
| Bonding of parts exposed to shock and vibration | Free of low-molecular cyclic siloxanes |
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