CEMEDINE 575F Organic Solvent Adhesive

CEMEDINE 575F is an industrial-grade instant adhesive based on α-cyanoacrylate technology developed by CEMEDINE, Japan.

It is a single-component fast-curing adhesive that cures through moisture present in the air and on the surface of adherends.

With its medium-high viscosity, excellent initial bonding strength, good positioning ability, and gap-filling performance, CEMEDINE 575F is suitable for precision parts, vertical bonding surfaces, and applications requiring reliable fixation with small gaps.

According to the inspection certificate, CEMEDINE 575F appears as a pale yellow translucent liquid, with a viscosity of 2360 mPa·s at 23℃ and an initial peel adhesion strength of 3.58 kN/m. The test results meet the specified requirements.

Product Features

Fast Curing

Cures rapidly through moisture in the air and on the substrate surface, improving assembly efficiency.

Medium-High Viscosity Formula

With a viscosity of 2360 mPa·s at 23℃, it provides good flow control and gap-filling performance.

High Initial Bonding Strength

Provides an initial peel adhesion strength of 3.58 kN/m, exceeding the specified requirement of ≥1.18 kN/m.

Single Component Design

No mixing or additional curing agent is required, allowing convenient application.

Good Positioning Performance

Compared with low-viscosity instant adhesives, it offers better control and suitability for small-gap bonding applications.

Applicable Industries / Equipment

Automotive Industry: Interior parts, plastic components, rubber parts

Electronics Industry: Plastic housings, insulation materials, small components

Precision Manufacturing: Instrument parts and functional assemblies

Rubber Products Industry: Rubber and plastic composite bonding

Industrial Products: Resin and metal component bonding