Bond CH38 Vinyl Acetate Resin Emulsion Adhesive
KONISHI BOND CH38 is a one-component moisture-curing polyurethane hot melt adhesive. It is applied after heating and melting, then further cures through reaction with moisture in the air. It provides high initial adhesion, good flexibility and durable bonding performance, making it suitable for rapid assembly applications.
Product Details
Product Features
One-component hot melt formulation with no mixing required
Fast positioning after melting, suitable for continuous production assembly
Moisture curing improves final bonding strength
Flexible adhesive layer accommodates differences in thermal expansion
Applicable Industries / Equipment
Furniture Manufacturing: Wood, panels and decorative material bonding
Automotive: Interior parts, plastic parts and composite components
Electronics & Electrical: Housings, component fixing and assembly
Industrial Manufacturing: Mechanical parts, packaging materials and composite structures
| Project | Content |
| Name | CH38 |
| Type | Industrial-grade wood glue |
| Temperature resistance range | -15°C - 45°C |
| Shelf life | 12 months |
| Curing method | Room temperature curing, open time 1 hour |
| Packaging specification | 3KG per bag (6 bags per box) |
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