CEMEDINE SX1008 One-Component Thermally Conductive Elastic Adhesive
The CEMEDINE SX-TCA series is a range of high-thermal-conductivity elastic adhesives combining heat transfer, elasticity and bonding performance. The main grades are SX1008, SX1010 and RH96L. SX1008 is the low-viscosity grade, SX1010 is the high-viscosity grade, and RH96L is the heat-resistant grade. All three products are one-component elastic adhesives based on specially modified acrylic polymers. After curing, they form an elastic thermally conductive layer that transfers heat while also bonding and fixing the component. Because the material cures rather than remaining as a grease-like thermal interface material, it resists oil bleed and pump-out and can also be used on vertical or vibration-prone assemblies. The SX-TCA series is free from low-molecular-weight cyclic siloxanes, reducing concerns about electrical contact failures near sensitive electronic components. Thermal conductivity ranges from approximately 1.7 to 2.14 W/m·K, and all three grades are RoHS compliant and equivalent to UL94 V-0.
Product Details
Product Features
Good Thermal Conductivity: SX1008, SX1010 and RH96L provide thermal conductivity of approximately 1.7, 2.1 and 2.14 W/m·K respectively, helping transfer heat from electronic components to heat sinks or housings.
Elastic Bonding Performance: Forms an elastic bonded layer after curing, combining thermal transfer and component fixation while accommodating vibration, thermal expansion and limited mechanical movement.
Siloxane-Free Formulation: Contains no low-molecular-weight cyclic siloxanes that may contribute to electrical contact failure.
Good Pump-Out Resistance: Once cured, the material is less likely to migrate or pump out under thermal cycling, pressure or vibration compared with non-curing thermal greases.
Multiple Viscosity Options: SX1008 is the low-viscosity grade, SX1010 is the high-viscosity grade and RH96L is designed for heat-resistant applications.
Fast Tack-Free Time: SX1008 and SX1010 reach tack-free condition in approximately 3 minutes at 23°C, while RH96L requires approximately 7 minutes.
Product Applications
CPUs and Semiconductor Devices: Suitable for thermal bonding between CPUs, power semiconductor devices and heat sinks.
Motor Control Modules: Suitable for DC motor control chips, driver modules and other motor-control electronics requiring heat dissipation and fixation.
Inverters and Power Modules: Suitable for inverters, DCDC, DCAC, power-supply modules and other power-electronics assemblies.
Automotive Electronics: Suitable for automotive control units, power-electronics modules and other components exposed to vibration and thermal cycling.
Industrial Control and Communication Equipment: Suitable for industrial controllers, communication equipment, LEDs and other electronic assemblies requiring thermal management and electrical insulation.
Vertical and Vibration-Prone Assemblies: Good adhesion and pump-out resistance make the series suitable for vertical installation and applications exposed to continuous vibration.
| Item | SX1008 | SX1010 | RH96L |
|---|---|---|---|
| Product Type | Low-Viscosity Thermally Conductive Elastic Adhesive | High-Viscosity Thermally Conductive Elastic Adhesive | Heat-Resistant Thermally Conductive Elastic Adhesive |
| Main Component | Specially Modified Acrylic Polymer | Specially Modified Acrylic Polymer | Specially Modified Acrylic Polymer |
| Component Type | One-Component | One-Component | One-Component |
| Appearance | White Paste | White Paste | Gray Paste |
| Viscosity @ 23°C | 120 Pa·s | 650 Pa·s | 250 Pa·s |
| SVI | 2.0 | 4.2 | 4.5 |
| Density | 1.98 g/cm³ | 2.00 g/cm³ | 2.15 g/cm³ |
| Tack-Free Time @ 23°C | 3 min | 3 min | 7 min |
| Hardness | Shore A 84 | Shore A 85 | Shore A 65 |
| Glass Transition Temperature | -62°C | -62°C | -44°C |
| Tensile Strength at Break | 2.5 MPa | 1.8 MPa | 1.1 MPa |
| Elongation at Break | 30% | 20% | 45% |
| Thermal Conductivity | 1.7 W/m·K | 2.1 W/m·K | 2.14 W/m·K |
| Coefficient of Linear Expansion | — | 77 ppm/K | 55 ppm/K |
| Volume Resistivity | 6.6×10¹² Ω·cm | 1.3×10¹³ Ω·cm | 4.1×10¹¹ Ω·cm |
| Dielectric Constant @ 1 MHz | 6.4 | 3.1 | 6.11 |
| Dissipation Factor @ 1 MHz | 0.11 | 0.12 | 0.14 |
| Dielectric Breakdown Strength | — | 38 kV/mm | 22 kV/mm |
