TERADA TERADITE TE-5111K2 One-Component Low-Shrinkage UV / Heat Dual-Cure Epoxy Resin
TERADITE TE-5111K2 is a one-component low-shrinkage functional epoxy resin developed by Terada Co., Ltd. It belongs to the TERADITE Functional Resin series and is primarily intended for the insulation and protection of electronic components. TE-5111K2 features a dual-curing system using either UV or heat, allowing flexible processing depending on production requirements. At 25°C, its viscosity is approximately 34,000 mPa·s and its specific gravity is approximately 1.85. After curing, the material provides a Shore D hardness of approximately 92, a Tg of approximately 153°C, and a CTE of approximately 14 ppm/K. It also provides flame-retardant performance equivalent to UL94 V-0 at 5 mm thickness, making it suitable for electronic protection applications requiring heat resistance, dimensional stability and flame retardancy.
Product Details
Product Features
Dual-Cure System: Supports both UV curing and thermal curing
Low Shrinkage: Low-shrinkage epoxy system helps reduce curing stress and dimensional change
High Heat Resistance: Tg of approximately 153°C
Low Thermal Expansion: CTE of approximately 14 ppm/K for improved dimensional stability
High Hardness: Shore D hardness of approximately 92 after curing
Flame Retardant: Equivalent to UL94 V-0 at 5 mm thickness
Product Applications
Electronic Components: Insulation, encapsulation and protection of electronic parts
Electrical Assemblies: Protective encapsulation of electrical modules and assemblies
Automotive Electronics: Suitable for sensors, automotive electrical modules and related components
Localized Encapsulation: Suitable for small electronic parts requiring rapid curing
Flame-Retardant Protection: Protection of components requiring flame resistance and thermal stability
Industrial Electronics: Insulation and protection of controllers, sensors and industrial electronic devices
| Item | TERADITE TE-5111K2 |
|---|---|
| Product Type | One-Component Functional Epoxy Resin |
| Main Application | Insulation and Protection of Electronic Components |
| Curing System | UV / Heat Dual Cure |
| Viscosity at 25°C | 34,000 mPa·s |
| Specific Gravity at 25°C | 1.85 |
| Hardness | Shore D 92 |
| Glass Transition Temperature | 153°C |
| CTE (α1) | 14 ppm/K |
| Flame Retardancy | UL94 V-0 Equivalent at 5 mm |
| Recommended UV Curing | 1,000 mJ/cm² |
| Recommended Heat Curing | 130°C × 5 min |
| Mix Ratio | Not Applicable (One-Component) |
| Key Properties | Low Shrinkage, Dual Cure, Heat Resistance, Flame Retardancy |
