CEMEDINE EP811 One-Part Heat-Curing Epoxy Potting Adhesive
CEMEDINE EP811 is a one-part heat-curing epoxy resin adhesive developed for potting and encapsulation applications. Its one-component formulation eliminates the need for resin/hardener measuring and mixing, helping reduce variation caused by mixing errors. EP811 is a reactive solvent-free adhesive with low curing shrinkage, high adhesion and good durability. Its standard curing condition is 120°C for 30 minutes, producing a hard, electrically insulating cured epoxy layer. The product is particularly designed for automotive and other demanding electronic applications. According to CEMEDINE, EP811 provides excellent heat resistance, reflow resistance, thermal shock resistance and chemical resistance. It also shows good adhesion to difficult substrates such as LCP (Liquid Crystal Polymer).
Product Details
Product Features
One-Part System:No measuring or mixing required
Heat-Curing Type:Standard curing condition of 120°C × 30 min
Suitable for Potting:Flow characteristics suitable for filling electronic assemblies
Excellent Heat Resistance:Suitable for high-temperature and reflow environments
Thermal Shock Resistance:Designed for applications exposed to thermal cycling
Chemical Resistance:Suitable for demanding industrial environments
Good Adhesion to LCP:Suitable for difficult-to-bond engineering plastics
Excellent Electrical Insulation:High volume resistivity and dielectric strength
Product Applications
Automotive Electronics:Potting of automotive electronic modules and control components
Relays:Encapsulation and insulation of relay assemblies
Electronic Components:Bonding, fixing and sealing electronic parts
Electrical Equipment:Potting applications requiring high insulation performance
LCP Components:Bonding of liquid crystal polymer and related engineering plastics
Precision Equipment:Assembly and protection of precision industrial components
| Item | CEMEDINE EP811 |
|---|---|
| Product Type | One-Part Heat-Curing Epoxy Adhesive |
| Brand | CEMEDINE |
| Model | EP811 |
| Application Type | Potting / Encapsulation |
| Grade | Flow Type |
| Base | Epoxy Resin |
| Appearance | Black |
| Viscosity | 150 Pa·s at 23°C |
| Density | 1.72 g/cm³ |
| Standard Curing Condition | 120°C × 30 min |
| Tensile Shear Strength | 18.4 MPa |
| Hardness | Shore D 92 |
| Glass Transition Temperature | 135°C |
| Elastic Modulus | 6500 MPa |
| Poisson's Ratio | 0.3 |
| Breaking Strength | 59 MPa |
| Elongation at Break | 1.19% |
| Water Absorption | 0.05% |
| Linear Expansion Coefficient | 2.6×10⁻⁵ /K |
| Volume Resistivity | 5.0×10¹⁵ Ω·cm |
| Dielectric Strength | ≥22 kV/mm |
| Dielectric Constant | 5.61 at 100Hz |
| Dielectric Loss Tangent | 0.02 at 100Hz |
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