Shin-Etsu Pure Sealant One-Component Low-Volatility Silicone Sealant for Clean Rooms
Shin-Etsu Pure Sealant is a one-component silicone sealing material designed for clean room applications. It is an oxime-type sealant that reacts with moisture in the air and cures at room temperature to form an elastic sealing material with excellent adhesion. It is particularly suitable for clean rooms requiring high cleanliness and strict chemical contamination control. One of its key characteristics is the very low evaporation of low-molecular-weight dimethyl siloxane. Shin-Etsu’s comparative testing shows that Pure Sealant releases much less low-molecular-weight siloxane than conventional products, making it well suited for semiconductor and precision-electronics manufacturing environments. The product is supplied as a one-component paste and can be applied directly from the cartridge without mixing. At 23°C and 50% RH, the tack-free time is approximately 3 minutes. After curing, it forms an elastic rubber-like material with a density of approximately 1.05 g/cm³, Shore A hardness of approximately 44, elongation at break of approximately 340%, and tensile strength of approximately 2.70 MPa.
Product Details
Product Features
・Very low evaporation of low-molecular-weight siloxanes
・One-component moisture-curing system
・Excellent durability, heat and weather resistance
・Good adhesion for cleanroom and semiconductor sealing
Product Applications
・Semiconductor Manufacturing: Airtight sealing of equipment
・Cleanrooms: Interior joints and structural sealing
・Air Filtration Systems: Sealing around air filters
・Precision Electronics: Sealing in electronic-material production areas
| Item | Shin-Etsu Pure Sealant |
|---|---|
| Product Type | One-Component Silicone Sealant |
| Cure Type | Oxime / Moisture Cure |
| Appearance Before Cure | Paste |
| Fluidity | None |
| Tack-Free Time (23℃ / 50%RH) | 3 min |
| Appearance After Cure | Elastic |
| Density (23℃) | 1.05 g/cm³ |
| Hardness | Durometer A 44 |
| Elongation at Break | 340% |
| Tensile Strength | 2.70 MPa |
| Modulus at 50% Elongation | 0.70 N/mm² |
| Tensile Stress at Maximum Load | 0.76 N/mm² |
| Elongation at Maximum Load | 70% |
| Cohesive Failure | 100% |
| Low-Molecular-Weight Dimethyl Siloxane Content | 60 ppm |
| Phosphorus Element | <1 ppm |
| Boron Element | <1 ppm |
| Antimony Element | <1 ppm |